LOCTITE® ABLESTIK FS 849-TI

Known as ABLEBOND FS849-TI (22G)

Features and Benefits

LOCTITE ABLESTIK FS 849-TI, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus
LOCTITE® ABLESTIK FS 849-TI is designed for power applications. This material is a medium modulus adhesive suited for a wide variety of die sizes where thermal and electrical conductivity are needed in a high reliability package.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 44.0 ppm/°C
Cure type Heat cure
Hot die shear strength 4.1 kg-f
Tensile modulus, @ 250.0 °C 1070.0 N/mm² (155190.0 psi )