LOCTITE® ABLESTIK FS 849-TI
Known as ABLEBOND FS849-TI (22G)
Features and Benefits
LOCTITE ABLESTIK FS 849-TI, Proprietary Hybrid Chemistry, Die Attach, Medium Modulus
LOCTITE® ABLESTIK FS 849-TI is designed for power applications. This material is a medium modulus adhesive suited for a wide variety of die sizes where thermal and electrical conductivity are needed in a high reliability package.
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Technical Information
Applications | Die attach |
Coefficient of thermal expansion (CTE) | 44.0 ppm/°C |
Cure type | Heat cure |
Hot die shear strength | 4.1 kg-f |
Tensile modulus, @ 250.0 °C | 1070.0 N/mm² (155190.0 psi ) |