LOCTITE® ABLESTIK ABP 8910T
Connu sous le nom de ABLESTIK ABP-8910T
Caractéristiques et avantages
This electrically-insulating die-attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
LOCTITE® ABLESTIK ABP 8910T is a heat cure, electrically non-conductive adhesive ideal for use on medium to large die sizes, and perfect for copper, silver, PPF and alloy 42 substrates. It has high MRT performance, high thermal conductivity, and high reliability.
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Informations techniques
| Applications | Soudage de puce |
| Coefficient de dilatation thermique (CDT) | 28.0 ppm/°C |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 13000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8910T
This electrically-insulating die-attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.