LOCTITE® ABLESTIK 8008HT
Connu sous le nom de ABLECOAT 8008HT
Caractéristiques et avantages
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.
LOCTITE® ABLESTIK 8008HT die-attach adhesive is perfect for high power devices in a high UPH environment. A lead-free alternative to soft solder and eutectic, it can potentially reduce the layers of backside metallization required. It can be applied to a wafer backside by stencil printing, B-staged in an oven, then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. Should be used with a pressure sensitive dicing tape. Not compatible with UV dicing tapes.
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Informations techniques
| Applications | Soudage de puce |
| Coefficient de dilatation thermique (CDT) | 37.0 ppm/°C |
| Coefficient de dilatation thermique (CDT), Above Tg | 62.0 ppm/°C |
| Conductivité thermique | 11.0 W/mK |
| Couleur | Argent |
| Indice thixotropique | 4.0 |
| Module d'élasticité, @ 250.0 °C | 2451.0 N/mm² (355340.0 psi ) |
| Programme de durcissement, Snap Cure @ 170.0 °C | 20.0 sec. |
| Résistance au cisaillement puce RT, 2 x 2 mm Si die on Cu leadframe | 6.0 kg-f |
| Résistance au cisaillement puce chaude, @ 260.0 °C 2 x 2 mm Si die on Cu LF | 2.6 kg-f |
| Résistivité volume | 0.00005 Ohm cm |
| Température de transition vitreuse | 264.0 °C |
| Teneur ionique extractible, Chlorure (Cl) | 9.0 ppm |
| Teneur ionique extractible, Potassium (K+) | 9.0 ppm |
| Teneur ionique extractible, Sodium (Na+) | 9.0 ppm |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 50000.0 mPa.s (cP) |
LOCTITE® ABLESTIK 8008HT
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.