State-of-the-art high bandwidth ASICs and CPUs, and high-performance GPUs for data processing in AI and MI applications are becoming larger and more complex, integrating multiple chips to achieve extraordinary data throughput. Heat must be effectively dissipated to meet the functional criteria, but mechanical pressure has to be controlled to avoid damage to the large, delicate die that range in size from 25 mm sq. to 75 mm sq.
The higher power concentrations of advanced processor packages dictate using a thin, low thermal impedance thermal interface material (TIM) to effectively manage the thermal loads, providing the most efficient heat transfer and enabling long-term reliability.
For next-generation server, router, and switch processor devices, a TIM solution should meet multiple requirements, including:
- Efficient heat reduction/dissipation for the application’s high power.
- Bond line thickness that is thin enough to enable miniaturization and provide a streamlined heat path.
- Good thermal performance that prioritizes low thermal impedance.
- Thermal stability in high temperature /high humidity environments.
- Easy handling and reworkability.