LOCTITE® ECCOBOND EN 3707F

Features and Benefits

LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant
LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
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Technical Information

Applications Encapsulating
Coefficient of thermal expansion (CTE), Above Tg 162.2 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 50.3 ppm/°C
Color Light blue
Cure schedule light intensity 100.0 mW/cm²
Cure schedule, @ 100.0 °C 5.0 min.
Cure schedule, @ 130.0 °C 1.0 - 2.0 min.
Cure schedule, @ 80.0 °C 30.0 min.
Cure type UV cure
Depth of cure 10.0 mm
Glass transition temperature (Tg) 37.0 °C
Shelf life 180.0 day
Shore hardness, Shore D 27.0
Storage modulus, DMA @ 25.0 °C 4400.0 N/mm² (638000.0 psi )
Storage temperature -20.0 °C
Thixotropic index 4.1
Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm 3480.0 mPa·s (cP)