LOCTITE® STYCAST US 0152

Features and Benefits

LOCTITE STYCAST US 0152, Urethane, Potting and Encapsulating
LOCTITE® STYCAST US 0152 is an unfilled, low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties and surface finish. This material can be used to encapsulate electronics for various applications including under-the-hood automotive and marine. The low glass transition temperature prevents damage to sensitive components during low temperature excursions. Please refer to the TDS for alternate cure schedules.
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Technical Information

Applications Encapsulating
Cure schedule, Alternate @ 60.0 - 85.0 °C 2.0 - 4.0 hr.
Cure schedule, Recommended @ 23.0 °C 24.0 hr.
Cure type Heat cure
Density 1.0 g/cm³
Glass transition temperature (Tg) -38.0 °C
Mix ratio, by volume 52 : 100
Mix ratio, by weight 1 : 2
Number of components 2 part
Physical form Liquid
Shore hardness, Shore A 35.0
Storage temperature 20.0 - 30.0 °C
Tensile strength 100.0 psi
Thermal conductivity 0.172 W/mK
Viscosity, @ 23.0 °C 450.0 mPa·s (cP)
Volume resistivity 1.9x10¹¹ Ohm cm
Mixed
Color, Mixed Opaque
Resin
Color, Resin Amber
Hardener
Color, Hardener Black