LOCTITE® ECCOBOND UF 8830S
Features and Benefits
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is specially designed to improve crack/fracture resistance and deliver faster flow. When fully cured, it forms a rigid, low-stress seal that dissipates stress in solder joints and extends thermal cycling performance.
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Technical Information
| Coefficient of thermal expansion (CTE), Above Tg | 100.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 25.0 ppm/°C |
| Glass transition temperature (Tg) | 118.0 °C |
| Storage modulus, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 8830S
This liquid epoxy underfill encapsulant is specially formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.