BERGQUIST® GAP FILLER TGF 2900LVO
Caractéristiques et avantages
This 2-part, 2.9 W/(m.K), low volatile silicone-based thermal gap filler is ideal for automotive electronic assemblies.
BERGQUIST® GAP FILLER TGF 2900LVO is a silicone, 2-part, room-temperature-curable gap filler, suitable for use in a wide range of electronic assembly applications. With a thermal conductivity of 2.9 W/(m.K) and the ability to achieve ultra-thin bond line thickness, it provides an excellent and versatile solution to optimise heat dissipation in challenging conditions. This material is an exceptional choice for automotive, industrial and consumer electronic applications.
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BERGQUIST® GAP FILLER TGF 2900LVO
This 2-part, 2.9 W/(m.K), low volatile silicone-based thermal gap filler is ideal for automotive electronic assemblies.