LOCTITE® ABLESTIK 8008HT
Known as ABLECOAT 8008HT
Features and Benefits
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.
LOCTITE® ABLESTIK 8008HT die-attach adhesive is perfect for high power devices in a high UPH environment. A lead-free alternative to soft solder and eutectic, it can potentially reduce the layers of backside metallization required. It can be applied to a wafer backside by stencil printing, B-staged in an oven, then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. Should be used with a pressure sensitive dicing tape. Not compatible with UV dicing tapes.
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Additional Documents
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 37.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 62.0 ppm/°C |
| Colour | Silver |
| Cure schedule, Snap Cure @ 170.0 °C | 20.0 sec. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Glass transition temperature (Tg) | 264.0 °C |
| Hot die shear strength, @ 260.0 °C 2 x 2 mm Si die on Cu LF | 2.6 kg-f |
| RT die shear strength, 2 x 2 mm Si die on Cu leadframe | 6.0 kg-f |
| Tensile modulus, @ 250.0 °C | 2451.0 N/mm² (355340.0 psi ) |
| Thermal conductivity | 11.0 W/mK |
| Thixotropic index | 4.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 50000.0 mPa·s (cP) |
| Volume resistivity | 0.00005 Ohm cm |
LOCTITE® ABLESTIK 8008HT
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.