LOCTITE® ABLESTIK ABP 8420

Features and Benefits

A non-conductive die-attach adhesive for cap and lid attach applications in wire bond packages.
LOCTITE® ABLESTIK ABP 8420 is a non-conductive epoxy adhesive for cap and lid attach applications in wire bond packages. It’s typically used for optical sensors, lenses and 3D modules. It’s jettable with minimal resin bleed-out (RBO) and minimal adhesion drop post-reliability. A bond line thickness of >1 mil must be maintained if used over an active die face to prevent die scarring. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box or convection oven curing, it will cure at temperatures as low as 80ºC (176ºF).
  • Non-conductive
  • Excellent resin bleed out (RBO) performance
  • Fast cure
  • Black pigmentation for blocking stray light
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 54.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 154.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 75.0 °C
Thermal conductivity 0.3 W/mK
Thixotropic index 5.8
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 13500.0 mPa·s (cP)