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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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  • A packshot of BERGQUIST GAP PAD TGP 3000ULM showing a grey gap pad.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 3000ULM

    Soft, fiberglass reinforced, electrically insulating pad

  • A product packshot showing BERGQUIST GAP FILLER TGF 3000SF in 3 different sized dual cartridges

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 3000SF

    Blue silicone-free gap filler

  • A packshot of BERGQUIST SIL PAD TSP Q2000 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD® TSP Q2000

    Electrically conductive fibreglass-reinforced pad - withstands processing stress

  • Packshot for black adhesive of LOCTITE ABLESTIK TE 3530 in 3cc, 5cc, 10cc, 30cc

    Thermally conductive adhesives

    LOCTITE® ABLESTIK TE 3530

    Thermally conductive epoxy adhesive for heat dissipation components

  • A packshot of BERGQUIST GAP PAD TGP 3004SF showing light grey sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 3004SF

    Soft, electrically insulating pad - silicone free

  • A packshot of BERGQUIST LIQUI FORM TLF 3800LVO showing a grey 30CC syringe and 600CC cartridge.

    Thermal gels

    BERGQUIST® LIQUI FORM TLF 3800LVO

    For silicone-sensitive applications

  • A packshot of BERGQUIST GAP PAD TGP 2400 showing light yellow sheets and die cuts.

    Thermal GAP PAD Materials

    BERGQUIST® GAP PAD® TGP 2400

    Soft, fibreglass-reinforced insulation pad - low stress applications

  • A packshot of BERGQUIST SIL PAD TSP 1800 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD® TSP 1800

    Electrically insulating, fibreglass-reinforced - exceptional performance

  • A packshot of BERGQUIST LIQUI BOND TLB SA2000 showing a pale yellow 30CC syringe and 600CC cartridge.

    Thermally conductive adhesives

    BERGQUIST® LIQUI BOND TLB SA2000

    Dispensable liquid adhesive for structural component bonding

  • A packshot of BERGQUIST SIL PAD TSP Q2500 showing black sheets, die cuts, a die cut roll, and a die cut adhesive roll.

    Thermal SIL PAD Materials

    BERGQUIST® SIL PAD® TSP Q2500

    Electrically conductive, aluminum-foil-reinforced pad - maximum heat transfer

  • A packshot of BERGQUIST BOND PLY TBP 1400LMS-HD showing yellow sheets, die cuts, and die cut roll.

    Thermally conductive adhesives

    BERGQUIST® BOND PLY TBP 1400LMS-HD

    Flexible, laminated material for structural component bonding

  • A packshot of BERGQUIST GAP FILLER TGF 1400SL showing yellow and white 50CC, 200CC, and 400CC kits.

    Thermal gap fillers

    BERGQUIST® GAP FILLER TGF 1400SL

    Self-leveling, injectable, thermally conductive liquid