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Henkel Adhesive Technologies
Thermal SIL PAD Materials
BERGQUIST® SIL PAD® TSP Q2500
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Electrically conductive, aluminum-foil-reinforced pad - maximum heat transfer
Thermally conductive films
BERGQUIST® microTIM mTIM 1013
Durable micro-thermal interface coating for pluggable optical modules
Thermal gap fillers
BERGQUIST® GAP FILLER TGF 3000SF
Blue silicone-free gap filler
BERGQUIST® SIL PAD® TSP Q2000
Electrically conductive fibreglass-reinforced pad - withstands processing stress
Thermally conductive adhesives
LOCTITE® ABLESTIK TE 3530
Thermally conductive epoxy adhesive for heat dissipation components
Thermal GAP PAD Materials
BERGQUIST® GAP PAD® TGP 3004SF
Soft, electrically insulating pad - silicone free
Thermal gels
BERGQUIST® LIQUI FORM TLF 3800LVO
For silicone-sensitive applications
BERGQUIST® GAP PAD® TGP 3000ULM
Soft, fiberglass reinforced, electrically insulating pad
BERGQUIST® SIL PAD® TSP A2000
Thermally conductive, tacky, fiberglass-reinforced insulating material
BERGQUIST® LIQUI FORM TLF 3500CGEL
Highly thermally conductive gel for demanding applications
BERGQUIST® LIQUI BOND TLB EA1800
Dispensable liquid for structural component bonding - high strength
BERGQUIST® SIL PAD® TSP 1600
Electrically insulating pad - highly compliant soft material