BERGQUIST® GAP FILLER TGF 2200 APS

BERGQUIST® GAP FILLER TGF 2200 APS is a 2-part, thermally conductive, silicone-based liquid gap filler which offers infinite thickness variations with little or no stress to the sensitive components during or following assembly. Designed for applications requiring low density for light-weighting, and high thermal conductivity to provide optimum thermal performance, its optimised shear-thinning characteristics make it easy to dispense, and you can expect excellent low- and high-temperature mechanical and chemical stability. Once cured, it provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and filling unique and intricate air voids and gaps. Perfect for use in automotive power storage (APS) applications.