BERGQUIST® GAP PAD® TGP 1000VOUS
Connu sous le nom de Gap Pad® VO Ultra Soft
Caractéristiques et avantages
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD® TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
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Informations techniques
| Conductivité thermique | 1.0 W/mK |
| Couleur | Rose |
| Module de Young, ASTM D575 | 55.0 KPa (8.0 psi ) |
| Température de service | -60.0 - 200.0 °C |
| Type porteur | Fibre de verre |
| Épaisseur standard | 0.508 - 6.35 mm |
BERGQUIST® GAP PAD® TGP 1000VOUS
This thermally conductive, silicone-based gap pad filler has a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.