BERGQUIST® GAP PAD® TGP 1500R

Connu sous le nom de Gap Pad® 1500R

Caractéristiques et avantages

BERGQUIST GAP PAD TGP 1500R, Thermally Conductive, Reinforced Gap Filling Material
BERGQUIST® GAP PAD TGP 1500R has the same highly conformable, low-modulus polymer as the standard GAP PAD TGP 1500. The fiberglass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.
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Informations techniques

Conductivité thermique 1.5 W/mK
Couleur Noir
Module de Young, ASTM D575 310.0 KPa (45.0 psi )
Température de service -60.0 - 200.0 °C
Type porteur Fibre de verre
Épaisseur standard 0.254 - 0.508 mm