BERGQUIST® GAP PAD® TGP 1000VOUSB
Conocido como Gap Pad® VO Ultra Soft-B
Características y Ventajas
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps
BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
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Información técnica
Color | Negro |
Conductividad térmica | 1.0 W/mK |
Espesor | 0.508 - 3.175 mm |
Módulo de Young, ASTM D575 | 55.0 KPa (8.0 psi ) |
Temperatura de funcionamiento | -60.0 - 200.0 °C |
Tipo de vehículo | Fibra de Vidrio |