LOCTITE® ABLESTIK DX20C
被称为 ECCOBOND DX-20C 0.03KG
功能与优点
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
LOCTITE® ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.
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技术信息
| RT 模剪切强度 | 12.8 kg-f |
| 主要特性 | 传导性：不导电 |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 热模剪切强度 | 5.0 kg-f |
| 粘度，锥型和板型, @ 25.0 °C Speed 10 rpm | 12000.0 mPa.s (cP) |
| 触变指数 | 4.2 |
LOCTITE® ABLESTIK DX20C
LOCTITE ABLESTIK DX20C dielectric adhesive offers excellent adhesion strength, especially at wire bonding process temperature to minimize defect rate at assembly. It features strong heat / UV resistance and can be applied by pin transfer, stamping and dispensing.