LOCTITE® ABLESTIK ABP 8062T
Known as ABP-8062T (17.5g)
Features and Benefits
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure
LOCTITE® ABLESTIK ABP 8062T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity. LOCTITE ABLESTIK ABP 8062T highly filled die attach adhesive is suited for small to middle die sizes where thermal and electrical conductivity are needed in a high reliability package.
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Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 100.0 ppm/°C |
| Cure type | Heat cure |
LOCTITE® ABLESTIK ABP 8062T
LOCTITE ABLESTIK ABP 8062T, BMI Hybrid, Heat cure