LOCTITE® 3621
旧名称 Chipbonder 3621
特長および利点
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
LOCTITE® 3621 is a surface mount adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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技術情報
| Casson粘度、コーン＆プレート Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 パスカル秒 |
| せん断強度, 鋼（グリットブラスト） | 2175.0 psi |
| 保存温度 | 2.0 - 8.0 °C |
| 外観 | ゲル |
| 形態 | 1液 |
| 熱膨張率, Above Tg | 100.0 ppm/°C |
| 硬化スケジュール, @ 150.0 °C | 90.0 - 120.0 秒 |
| 硬化タイプ | 熱硬化 |
| 降伏点、コーンプレート、Haake PK100、M10/PK1、2°, @ 25.0 °C | 130.0 - 280.0 パスカル秒 |
LOCTITE® 3621
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.