Die Attach Paste

Addressing the requirements for both laminate and leadframe wirebond packages, Henkel has developed a comprehensive portfolio of die attach pastes for various wirebond requirements – from smaller die-to-pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion. Die attach pastes are also a common solution to problems relating to lead free soldering. As the market share leader and top innovator of the most advanced die attach solutions, Henkel’s LOCTITE^® ABLESTIK^® portfolio delivers exceptional die packaging reliability performance.

Strong die-to-substrate bonds are the foundation of robust semiconductor packages. With multiple formulations to satisfy the requirements of both laminate and leadframe wirebond designs, Henkel die attach pastes provide the thermal, electrical, adhesion and processing attributes necessary to achieve in-application form and function expectations and meet the most stringent industry reliability standards.

Contact us today to discuss our die attach paste solutions with our team of experts

Henkel’s Die Attach Paste Product Solutions

We understand that different needs require a variety of products. Henkel’s LOCTITE^® ABLESTIK^® brand has been trusted supplying adhesive solutions to customers for decades and has developed a number of die attach paste formulations include conductive and non-conductive die attach pastes as well as full-sintering and pressure-less sintering die attach pastes.

Conductive Die Attach Pastes

Henkel electrically conductive die attach pastes for leadframe  and laminate wirebond packages satisfy numerous application-specific processing and performance requirements. Whether prioritizing small die-to-pad ratios, thin bondlines, high temperature capability or all of the above, Henkel’s portfolio has a broad selection of proven materials that ensure operational and device functionality objectives are met.

A broad selection of electrically conductive LOCTITE^® ABLESTIK^® conductive die attach paste formulations provide the reliability and performance today’s high-density laminate packages demand. Each package type – from BGAs to LGAs to Smart Cards – has different requirements, which is why Henkel has developed a suite of products that cater to the unique needs of laminate-based devices. Henkel conductive die attach pastes offer a low modulus for stress reduction and warpage elimination, as well as Bismaleimide (BMI) formulations for low moisture absorption to avoid package cracking during high temperature processing.

Process flexibility and superior performance underscore Henkel’s complete portfolio of conductive die attach pastes for leadframe devices. Incorporated into applications such as automotive electronics, where temperature control and unfailing function are critical, LOCTITE^® ABLESTIK^® die attach pastes deliver high thermal conductivity and high reliability. Robust adhesion to various metal surfaces including palladium, copper, silver, gold and PPF along with proven low-bleed formulas make Henkel’s die attach materials the products of choice for leadframe packaging specialists.

Henkel’s novel wafer backside coating materials allow for screen or stencil printing of the paste across the entire wafer in a single stroke, increasing throughput by eliminating the need to individually dispense dots of adhesive. After B-staging to create a film, wafer backside coating provides consistent bond lines and small, controlled fillets, which are particularly effective for attaching small die in miniaturized packages and challenging structures like chip-on-lead, where the die pad is smaller than the die.

Non-Conductive Die Attach Pastes

Henkel non-conductive die attach pastes are designed to deliver strong adhesion within both laminate and leadframe wirebond packages. Robust die stacking, thin bondlines, low warpage, high temperature compatibility, and low stress are a few of the many material capabilities of Henkel’s line of non-conductive die attach pastes. Ensuring package integrity, while adhering to stringent JEDEC MSL1 standards, non-conductive die attach pastes deliver the reliability required for next generation wirebond package designs.

Printable Board-On-Chip Die Attach Materials

As board-on-chip (BOC) – also known as substrate-on-chip – packaging emerges as the dominant chip-scale packaging configuration for DRAM devices, die attach materials must deliver with precise control of bondline thickness and die tilt, minimal fillet formation and no contamination of wire bond pads. Henkel’s B-stage printable adhesives offer a more cost-effective solution than conventional adhesive films, providing the robust performance of film at a paste price point. The portfolio of LOCTITE^® ABLESTIK^® materials for BOC applications offers high UPH, printable formulations with low flow, controlled bondlines, minimized tolerance and bleed, as well as long storage and work lives.

Full-Sintering Die Attach paste

The increasing request of electrical/hybrid vehicle and 5G communication drives the need of the solutions providing better thermal dissipation, reliability, and thermal stability (bond joint temperatures can be up to 175°C with 50-100°C delta in a few seconds or a few minutes). Pure silver sintering die attach paste has attracted attention because AG has the best electrical conductivity, the second-best thermal conductivity, and the high thermal stability. The pure metallic bond formed at interface also provided much better reliability than solder.

Henkel full silver sintering material SSP2020 can support both pressureless and pressure assistant sintering according to customer needs. It provides >200W/mk thermal conductivity, proved reliability, and excellent workability even under pressure less condition. We also offer full-sintering silver die attach paste for increased conductive performance in electronic applications.

Pressure-Less Sintering Die Attach Paste

Smaller, higher functioning devices within applications in various market sectors are increasing power densities and driving the need for more effective heat dissipation. While thermal interface materials offer this capability at the board and component level, more user-friendly and effective thermal management solutions are needed at the die level.

Henkel's new series of high thermal pressure-less sintering die attach pastes enable robust package-level sintering and overcome the regulatory challenges of solder, thermal conductivity limitations of traditional die attach materials, and processability complexities of pure sintering pastes. The LOCTITE^® ABLESTIK^® ABP 8068T portfolio are high thermal, pressure-less sintering die attach pastes that offer simplified processing, and best-in-class thermal and electrical performance with robust reliability for today’s high-power density devices.

Contact us today to discuss our die attach paste solutions with our team of experts.

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