BERGQUIST® SIL PAD® TSP 3500
다른 명칭: Sil-Pad® 2000
특징 및 이점
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
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문서 및 다운로드
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기술 정보
색상 | 흰색 |
열전도율 | 3.5 W/mK |
작동 온도 | -60.0 - 200.0 °C |
캐리어 유형 | 유리섬유 |
표준 두께 | 0.254 - 0.508 mm |
화염 등급 | V-0 |