LOCTITE® ECCOBOND FP4502
Features and Benefits
This 1-part, high purity, low-CTE liquid epoxy is specially designed as an underfill for flip chip devices.
LOCTITE ECCOBOND FP4502 is a high purity, liquid epoxy designed as an underfill for flip chip devices. It is a 1-part low-CTE (coefficient of thermal expansion) epoxy used to dissipate stress on solder joints. It extends thermal cycling performance, is compatible with no clean flux, and has excellent crack and fracture resistance.
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LOCTITE® ECCOBOND FP4502
This 1-part, high purity, low-CTE liquid epoxy is specially designed as an underfill for flip chip devices.