LOCTITE® ABLESTIK ABP 8910T
Conocido como ABLESTIK ABP-8910T
Características y Ventajas
This electrically-insulating die-attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.
LOCTITE® ABLESTIK ABP 8910T is a heat cure, electrically non-conductive adhesive ideal for use on medium to large die sizes, and perfect for copper, silver, PPF and alloy 42 substrates. It has high MRT performance, high thermal conductivity, and high reliability.
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Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 28.0 ppm/°C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 13000.0 mPa.s (cP) |
LOCTITE® ABLESTIK ABP 8910T
This electrically-insulating die-attach adhesive is formulated with a medium modulus using hybrid chemistry, and is targeted for use on medium to large die sizes.