LOCTITE® ABLESTIK ABP 8420
Features and Benefits
A non-conductive die-attach adhesive for cap and lid attach applications in wire bond packages.
LOCTITE® ABLESTIK ABP 8420 is a non-conductive epoxy adhesive for cap and lid attach applications in wire bond packages. It’s typically used for optical sensors, lenses and 3D modules. It’s jettable with minimal resin bleed-out (RBO) and minimal adhesion drop post-reliability. A bond line thickness of >1 mil must be maintained if used over an active die face to prevent die scarring. It cures fast when exposed to direct heat energy or hot-plate techniques. In conventional box or convection oven curing, it will cure at temperatures as low as 80ºC (176ºF).
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 54.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 154.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 75.0 °C |
| Thermal conductivity | 0.3 W/mK |
| Thixotropic index | 5.8 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 13500.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 8420
A non-conductive die-attach adhesive for cap and lid attach applications in wire bond packages.