LOCTITE® ABLESTIK 8008HT
Bekannt als ABLECOAT 8008HT
Merkmale und Vorteile
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.
LOCTITE® ABLESTIK 8008HT die-attach adhesive is perfect for high power devices in a high UPH environment. A lead-free alternative to soft solder and eutectic, it can potentially reduce the layers of backside metallization required. It can be applied to a wafer backside by stencil printing, B-staged in an oven, then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. Should be used with a pressure sensitive dicing tape. Not compatible with UV dicing tapes.
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Technische Informationen
| Anwendungen | Gesenk-Verbindung |
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, Snap Cure @ 170.0 °C | 20.0 Sek. |
| Extrahierbarer Ionengehalt, Chlorid (CI-) | 9.0 ppm |
| Extrahierbarer Ionengehalt, Kalium (K+) | 9.0 ppm |
| Extrahierbarer Ionengehalt, Natrium (Na+) | 9.0 ppm |
| Farbe | Silber |
| Glasübergangstemperatur (Tg) | 264.0 °C |
| RT Scherfestigkeit der Matrize, 2 x 2 mm Si die on Cu leadframe | 6.0 kg-f |
| Thixotropie Index | 4.0 |
| Viskosität, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 50000.0 mPa.s (cP) |
| Volumenwiderstand | 0.00005 Ohm cm |
| Warmgesenkscherfestigkeit, @ 260.0 °C 2 x 2 mm Si die on Cu LF | 2.6 kg-f |
| Wärmeausdehnungskoeffizient (CTE) | 37.0 ppm/°C |
| Wärmeausdehnungskoeffizient (CTE), Above Tg | 62.0 ppm/°C |
| Wärmeleitfähigkeit | 11.0 W/mK |
| Zugfestigkeitsmodul, @ 250.0 °C | 2451.0 N/mm² (355340.0 psi ) |
LOCTITE® ABLESTIK 8008HT
A 1-part, proprietary hybrid chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high power devices in a high UPH environment.