LOCTITE® ABLESTIK 2053S
Conocido como ABLEBOND 2053S (10G)
Características y Ventajas
This red, non-conductive die-attach adhesive is designed for flex, laminate and die-to-die.
LOCTITE® ABLESTIK 2053S is a polymer-filled, hybrid, non-conductive die-attach adhesive for array packaging. It's typically used for the ASIC (Application Specific Integrated Circuit) attach of automotive optical sensors, and as a receiver and die-attach for 3D sensing modules. It's proven effective on various substrates, such as EMC, engineering plastic, glass and metals, and offers low warpage, stress and moisture uptake. It s a low-modulus adhesive, making it ideal for wire bonding small die sizes and chip bonding on FR4 substrates. It cures when exposed to heat.
Leer más
Documentos y Descargas
¿Está buscando un TDS o SDS en otro idioma?
Información técnica
| Aplicaciones | Unión |
| Coeficiente de dilatación térmica (CDT) | 149.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Above Tg | 216.0 ppm/°C |
| Contenido iónico extraíble, Cloruro (CI-) | 9.0 ppm |
| Contenido iónico extraíble, Potasio (K+) | 9.0 ppm |
| Contenido iónico extraíble, Sodio (Na+) | 9.0 ppm |
| Módulo de tracción, @ 250.0 °C | 22.0 N/mm² (3200.0 psi ) |
| Resistencia al corte a temperatura ambiente | 6.0 kg-f |
| Resistencia al corte con calor | 2.1 kg-f |
| Temperatura de transición vítrea (Tg) | -21.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 130000.0 mPa.s (cP) |
| Índice tixotrópico | 2.5 |
LOCTITE® ABLESTIK 2053S
This red, non-conductive die-attach adhesive is designed for flex, laminate and die-to-die.